cystech electronics corp. spec. no. : c303s2-r issued date : 2005.08.18 revised date : 2010.12.20 page no. : 1/6 1SS355S2 cystek product specification high ?speed switching diode 1SS355S2 description the 1SS355S2 is a high-speed switching diode fabricat ed in planar technology, and encapsulated in the small sod-323 plastic smd package. symbol outline 1SS355S2 sod-323 + - features ? small plastic smd package ? high switching speed: max. 4ns ? reverse voltage: max. 100v ? peak forward surge current: max. 500ma . ? pb-free package applications ? high-speed switching in thick and thin-film circuits. absolute maximum ratings @t a =25 parameters symbol min max unit dc reverse voltage v r - 100 v peak reverse voltage v rm - 110 v average rectified output current i o - 100 ma forward current i fm - 225 ma peak forward surge current i fsm 500 ma junction temperature t j - 125 c storage temperature t stg -55 +125 c
cystech electronics corp. spec. no. : c303s2-r issued date : 2005.08.18 revised date : 2010.12.20 page no. : 2/6 1SS355S2 cystek product specification electrical characteristics @ t a =25 unless otherwise specified parameters symbol conditions min typ. max unit reverse breakdown voltage v r i r =100 a 100 - - v forward voltage v f i f =100ma - - 1.2 v reverse leakage current i r v r =100v - - 0.1 a diode capacitance c d v r =0.5v, f=1mhz - - 3 pf reverse recovery time trr when switched from i f =10ma to i r =10ma,r l =100? , measured at i r =1ma - - 4 ns thermal characteristics symbol parameter conditions max unit ptot, ta=25 derate above 25 total device dissipation on fr-4 board note 1 200 1.57 mw mw/ rth, j-a thermal resistance from junction to ambient note 1 635 /w note 1: device mounted on an fr-4 pcb. ordering information device package shipping marking 1SS355S2 sod-323 (pb-free package) 3000 pcs / tape & reel 5d or a
cystech electronics corp. spec. no. : c303s2-r issued date : 2005.08.18 revised date : 2010.12.20 page no. : 3/6 1SS355S2 cystek product specification characteristic curves forward current vs forward voltage 0.1 1 10 100 0.2 0.4 0.6 0.8 1 1.2 forward voltage---v f (v) forward current---i f (ma) ta= - 40 ta= 2 5 ta=8 5 reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 0 1020304050 reverse voltage---v r (v) reverse leakage current---i r( a) ta= 125 ta= 25 ta= 150 ta=55 ta=85 capacitance vs reverse voltage 0.52 0.56 0.6 0.64 0.68 0 0.2 0.4 0.6 0.8 reverse voltage---v r (v) diode capacitance ---c d (pf) f=1mhz ta=25
cystech electronics corp. spec. no. : c303s2-r issued date : 2005.08.18 revised date : 2010.12.20 page no. : 4/6 1SS355S2 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c303s2-r issued date : 2005.08.18 revised date : 2010.12.20 page no. : 5/6 1SS355S2 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c303s2-r issued date : 2005.08.18 revised date : 2010.12.20 page no. : 6/6 1SS355S2 cystek product specification sod-323 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0630 0.0709 1.60 1.80 e 0.0060 ref 0.15 ref b 0.0453 0.0531 1.15 1.35 h 0.0000 0.0040 0.00 0.10 c 0.0315 0.0394 0.80 1.00 j 0. 0035 0.0070 0.089 0.177 d 0.0098 0.0157 0.25 0.40 k 0.0906 0.1063 2.30 2.70 notes: 1.controlling dimension : millimeters. 2.lead thickness specified per l/f drawing with solder plating. 3.if there is any question with pa cking specification or packing me thod, please contact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . d a h j k c e b 1 2 marking: 5 h xx xx represents : normal : 5d special : a style: pin 1.cathode 2.anode 2-lead sod-323 plastic surface mounted package, cystek package code: s2
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